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No.3(pp.119-150)

Home > Issues > Volume 11 (2006) > No.3(pp.119-150)

Interface between the Electroplated Copper-cobalt Thin Films and the Substrate

Journal of Magnetics, Volume 11, Number 3, 30 Sep 2006, Pages 119-122

Jin-Gyu Kim(Division of Electron Microscopic Research, Korea Basic Science Institute), Jung-ju Lee(Institute of Quantum Physics and Department of Physics, Chungnam National University), Jong-hak Bae(Institute of Quantum Physics and Department of Physics, Chungnam National University), Won-bae Bang(Institute of Quantum Physics and Department of Physics, Chungnam National University), Kim-in Hong*

(Institute of Quantum Physics and Department of Physics, Chungnam National University), C. H Yoon(Department of Physics, Hannam University), Derac Son(Department of Physics, Hannam University), Kee-ju Jeong(Department of Physics Education, Kongju National University)

Abstract

We electroplated copper-cobalt thin films on a silicon substrate, which had 150 nm thick copper seed layer. The adhesion between the two metallic layers could be increased by utilizing a proper organic additive, pulse plating technique, and high temperature annealing. The thin films exhibited columnar growth of the deposits and enhanced adhesion. This is attributed to the grain growth mechanism introduced by the additive and annealing.

Keywords: electroplating; Copper; Cobalt; thin film; interface

DOI:

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